Patents/Inventors

Rahul N. Manepalli

Chandler, AZUS22 patents

19 Patents

US125990102026
Microelectronic Packages with Embedded Interposers
Intel Corporation
0 cites
US125688172026
Surface Functionalization of Sinx Thin Film by Wet Etching for Improved Adhesion of Metal-dielectric for HSIO
Intel Corporation
0 cites
US124762142025
Solder Interconnect Hierarchy for Heterogeneous Electronic Device Packaging
Intel Corporation
0 cites
US123277732025
Package with Underfill Containment Barrier
Intel Corporation
0 cites
US123006202025
Inorganic-based Embedded-die Layers for Modular Semiconductive Devices
Intel Corporation
0 cites
US122180402025
Nested Interposer with Through-silicon via Bridge Die
Intel Corporation
0 cites
US121487042024
Electrical Interconnect Bridge
Intel Corporation
0 cites
US120877002024
Embedded Die Microelectronic Device with Molded Component
Intel Corporation
0 cites
US120681722024
Sacrificial Pads to Prevent Galvanic Corrosion of FLI Bumps in EMIB Packages
Intel Corporation
0 cites
US119554482024
Architecture to Manage FLI Bump Height Delta and Reliability Needs for Mixed EMIB Pitches
Intel Corporation
0 cites
US119358052024
Package with Underfill Containment Barrier
Intel Corporation
0 cites
US119233072024
Microelectronic Structures Including Bridges
Intel Corporation
0 cites
US119012482024
Embedded Die Architecture and Method of Making
Intel Corporation
0 cites
US118626192024
Patch Accommodating Embedded Dies Having Different Thicknesses
Intel Corporation
0 cites
US118108592023
Multi-layered Adhesion Promotion Films
Intel Corporation
0 cites
US117988872023
Inorganic-based Embedded-die Layers for Modular Semiconductive Devices
Intel Corporation
0 cites
US117912692023
Electrical Interconnect Bridge
Intel Corporation
0 cites
US116642902023
Package with Underfill Containment Barrier
Intel Corporation
0 cites
US116005632023
Molded Embedded Bridge Including Routing Layers for Enhanced EMIB Applications
Intel Corporation
0 cites