Patents/Inventors

Rahul Manepalli

Chandler, AZUS21 patents

17 Patents

US125688312026
Patternable Die Attach Materials and Processes for Patterning
Intel Corporation
0 cites
US124160932025
Electroless Plating Process
Intel Corporation
0 cites
US123411172025
Methods and Apparatus to Reduce Defects in Interconnects Between Semiconductor Dies and Package Substrates
Intel Corporation
0 cites
US123083292025
Chiplet First Architecture for Die Tiling Applications
Intel Corporation
0 cites
US122438252025
Hybrid Conductive Vias for Electronic Substrates
Intel Corporation
0 cites
US121598252024
Dielectric-to-metal Adhesion Promotion Material
Intel Corporation
0 cites
US121257932024
Hybrid Fan-out Architecture with EMIB and Glass Core for Heterogeneous Die Integration Applications
Intel Corporation
0 cites
US120876952024
Hybrid Fan-out Architecture with EMIB and Glass Core for Heterogeneous Die Integration Applications
Intel Corporation
0 cites
US119904272024
Chiplet First Architecture for Die Tiling Applications
Intel Corporation
0 cites
US119786852024
Glass Core Patch with in Situ Fabricated Fan-out Layer to Enable Die Tiling Applications
Intel Corporation
0 cites
US119730412024
Chiplet First Architecture for Die Tiling Applications
Intel Corporation
0 cites
US119233122024
Patternable Die Attach Materials and Processes for Patterning
Intel Corporation
0 cites
US117697352023
Chiplet First Architecture for Die Tiling Applications
Intel Corporation
0 cites
US117568902023
Hybrid Fan-out Architecture with EMIB and Glass Core for Heterogeneous Die Integration Applications
Intel Corporation
0 cites
US116948982023
Hybrid Fine Line Spacing Architecture for Bump Pitch Scaling
Intel Corporation
0 cites
US116580552023
Customizable Release Layers to Enable Low Warpage Architectures for Advanced Packaging Applications
Intel Corporation
0 cites
US116462742023
Multi-package Assemblies Having Foam Structures for Warpage Control
Intel Corporation
0 cites