Patents/Inventors

Rahul Jain

IndoreIN47 patents

44 Patents

US126092212026
Plug Mounted Surge Arrester
S&C Electric Company
0 cites
US125984782026
Methods and Systems for Coverage Area Deficiency Visualizations
RAKUTEN SYMPHONY, Inc.
0 cites
US125500962026
ROHC Optimization to Avoid Decompression Failure
QUALCOMM Incorporated
0 cites
US125306682026
Systems and Methods of Controlling Point of Sale Systems
Walmart Apollo, LLC
0 cites
US124443152025
Visualizing Causality in Mixed Reality for Manual Task Learning
Purdue Research Foundation
0 cites
US124135792025
Securing Connections Between a Networking and Security Controller and Distributed Agents in a Container-based Cluster
Vmware LLC
0 cites
US123622502025
Protruding SN Substrate Features for Epoxy Flow Control
Intel Corporation
0 cites
US123344472025
Lithographically Defined Vertical Interconnect Access (VIA) for a Bridge Die First Level Interconnect (FLI)
0 cites
US123344532025
Soldered Metallic Reservoirs for Enhanced Transient and Steady-state Thermal Performance
Intel Corporation
0 cites
US123277732025
Package with Underfill Containment Barrier
Intel Corporation
0 cites
US122891952025
Automated Root Cause Analysis of Network Issues in a Cellular Network Using Machine Learning
TELEFONAKTIEBOLAGET LM ERICSSON (PUBL)
0 cites
US122242642025
Die Interconnect Substrates, a Semiconductor Device and a Method for Forming a Die Interconnect Substrate
Intel Corporation
0 cites
US121920612025
Network Visualization System and Method of the Same
RAKUTEN SYMPHONY, Inc.
0 cites
US121706162024
Tunnel-based Service Insertion in Public Cloud Environments
Vmware LLC
0 cites
US121547152024
Methods to Selectively Embed Magnetic Materials in Substrate and Corresponding Structures
Intel Corporation
0 cites
US120747312024
Transitive Routing in Public Cloud
Vmware LLC
0 cites
US120747732024
Network Viewport Data Fetching and Visualization System and Method of the Same
RAKUTEN SYMPHONY, Inc.
0 cites
US120409402024
Deploying Upgrades for Cloud Services
Snowflake Inc.
0 cites
US120156592024
Optimized Transmission and Consumption of Digital Content
International Business Machines Corporation
0 cites
US120092712024
Protruding SN Substrate Features for Epoxy Flow Control
Intel Corporation
0 cites
US119781062024
Method and Non-transitory, Computer-readable Storage Medium for Deep Learning Model Based Product Matching Using Multi Modal Data
Price Technologies Inc.
0 cites
US119358052024
Package with Underfill Containment Barrier
Intel Corporation
0 cites
US119347002024
Fused Command Handling
WESTERN DIGITAL TECHNOLOGIES, Inc.
0 cites
US119011152024
Substrate Assembly with Encapsulated Magnetic Feature
Intel Corporation
0 cites
US118814632024
Coreless Organic Packages with Embedded Die and Magnetic Inductor Structures
Intel Corporation
0 cites
US118488002023
Connecting Virtual Computer Networks with Overlapping IP Addresses Using Transit Virtual Computer Network
VMWARE, Inc.
0 cites
US118429812023
Die Interconnect Substrates, a Semiconductor Device and a Method for Forming a Die Interconnect Substrate
Intel Corporation
0 cites
US118216262023
Cross Compatible Adapter for Chimney Sections with Different Outer Diameters
Cardinal IP Holding, LLC
0 cites
US117768642023
Corner Guard for Improved Electroplated First Level Interconnect Bump Height Range
Intel Corporation
0 cites
US117702922023
Extending Remote Diagnosis Cloud Services
Snowflake Inc.
0 cites
US117504522023
Fail-over in Cloud Services
Snowflake Inc.
0 cites
US117355372023
Methods to Embed Magnetic Material as First Layer on Coreless Substrates and Corresponding Structures
Intel Corporation
0 cites
US117363452023
System and Method for Extending Cloud Services Into the Customer Premise
Snowflake Inc.
0 cites
US117363462023
Monitoring Status Information of Devices
Snowflake Inc.
0 cites
US117372082023
Microelectronic Assemblies Having Conductive Structures with Different Thicknesses
Intel Corporation
0 cites
US116760512023
Predict Solutions for Potential Hazards of Stored Energy
International Business Machines Corporation
0 cites
US116642902023
Package with Underfill Containment Barrier
Intel Corporation
0 cites
US116519022023
Patterning of Thin Film Capacitors in Organic Substrate Packages
Intel Corporation
0 cites
US116520712023
Electronic Device Package Including a Capacitor
Intel Corporation
0 cites
US116270802023
Service Insertion in Public Cloud Environments
VMWARE, Inc.
0 cites
US116107062023
Release Layer-assisted Selective Embedding of Magnetic Material in Cored and Coreless Organic Substrates
Intel Corporation
0 cites
US115812712023
Methods to Pattern TFC and Incorporation in the ODI Architecture and in Any Build Up Layer of Organic Substrate
Intel Corporation
0 cites
US115701042023
Tunnel-based Service Insertion in Public Cloud Environments
VMWARE, Inc.
0 cites
US115574892023
Cavity Structures in Integrated Circuit Package Supports
Intel Corporation
0 cites