16 Patents
- US125507722026Semiconductor Package Conductive Terminals with Reduced Plating Thickness
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- US122887632025Flip Chip Package Assembly Having Post Connects with Solder-based Joints
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- US118625762024IC Having Electrically Isolated Warpage Prevention Structures
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0 cites - US118644712024Semiconductor Device with Passivated Magnetic Concentrator
Texas Instruments Incorporated
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