99 Patents
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MOMENTIVE PERFORMANCE MATERIALS JAPAN LLC
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INTEL CORPORATION
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Intel Corporation
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INTEL CORPORATION
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KNAUF GIPS KG
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- US122017152025Personal Care Composition Containing Spherical Silicone Elastomer Fine Particles
MOMENTIVE PERFORMANCE MATERIALS Inc.
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Intel Corporation
0 cites - USD10542232024Car Seat0 cites
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ZHEJIANG UNIVERSITY OF TECHNOLOGY
0 cites - US121460082024Modified Chitosan, Preparation Method Thereof, and Additive for Tile Adhesive and Use Thereof
SHANDONG ETON NEW MATERIAL CO., Ltd.
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INTEL CORPORATION
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Intel Corporation
0 cites - US119996582024High Salt Gypsum Wallboard Containing Salt Absorbents and Methods of Making Same
UNITED STATES GYPSUM COMPANY
0 cites - US119930542024Method of Preparing Gypsum Wallboard from High Salt Gypsum, and Related Product
United States Gypsum Company
0 cites - US119850802024Apparatus, System, and Method of Communicating an Extremely High Throughput (EHT) Physical Layer (PHY) Protocol Data Unit (PPDU)
INTEL CORPORATION
0 cites - US119707612024Iron-based Amorphous Alloy and Preparation Method Therefor
QINGDAO YUNLU ADVANCED MATERIALS TECHNOLOGY CO., Ltd.
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- US119457512024Calcium Aluminate Cement and Calcium Sulfoaluminate Cement Catalysts in Gypsum Panels and Use Thereof
KNAUF GIPS KG
0 cites - US119496062024Increased Utilization of Wireless Frequency Channels Partially Occupied by Incumbent Systems
Intel Corporation
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- US119248662024EHT Station Configured to Encode U-SIG for Transmission of EHT PPDU of 40, 80, 160 and 320 Mhz Bandwidths
Intel Corporation
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United States Gypsum Company
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Intel Corporation
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- US118314222023Apparatus, System and Method of Transmitting a PPDU Over a 320 Megahertz Channel Bandwidth
INTEL CORPORATION
0 cites - US118187562023Availability Indication for Uplink Location Measurement Report Feedback
Intel Corporation
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Intel Corporation
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INTEL CORPORATION
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- US117606892023Methods of Removing Chloride from Gypsum Having High Level of Chloride Salt
KNAUF GIPS KG
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- US117535502023Borate and Silicate Coating for Improved Acoustical Panel Performance and Methods of Making Same
USG INTERIORS, LLC
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- US117161212023NDPA for Multi-ap Coordinated Beamforming (CBF) and Multi-ap Joint Transmission (JT) in EHT
Intel Corporation
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- US117023732023Gypsum Wallboard with Enhanced Fire Resistance, and Related Coatings and Methods
United States Gypsum Company
0 cites - US117005132023Apparatus, System and Method of Communicating a Next Generation Vehicular (NGV) Physical Layer (PHY) Protocol Data Unit (PPDU)
INTEL CORPORATION
0 cites - US116836942023Access Point (AP) Multi-link Device (MLD) Configured for Multi-link Operation (MLO)
Intel Corporation
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- US116416572023Resource Unit (RU) Allocation for EHT for Power Spectral Density Limitations
Intel Corporation
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- US116217532023Multi-ap Coordinated Beamforming (CBF) for Extremely High Throughput (EHT)
Intel Corporation
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- US115641092023Apparatus to Enable EHT Multi-ap Group Formation in a Multi-ap Network
Intel Corporation
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