52 Patents
- US125854502026Rateless Erasure Coding for Multi-hop Broadcast Transmission in Wireless Iot Networks
Mitsubishi Electric Corporation
0 cites - US125728152026System and Method for Training a Regression Neural Network for Localization of a Device in an Environment
Mitsubishi Electric Research Laboratories, Inc.
0 cites - 0 cites
- US124631082025Semiconductor Device and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - 0 cites
- US124208002025System and Method for Tracking an Expanded State of a Moving Object Using an Online Adapted Compound Measurement Model
Mitsubishi Electric Research Laboratories, Inc.
0 cites - US124245872025Semiconductor Device Having Underfill Surrounding Bottom Package and Solder Ball
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY Ltd.
0 cites - US124128022025Heat Dissipation Structures for Integrated Circuit Packages and Methods of Forming the Same
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites - US123726092025Frequency Modulation Continuous Wave (fmcw)-based System for Estimation and Compensation of Nonlinearity in Linearly Swept Sources
Mitsubishi Electric Research Laboratories, Inc.
0 cites - US123680842025Package Structure and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US123622452025Package Assembly Including a Package Lid Having an Inner Foot and Methods of Making the Same
Taiwan Semiconductor Manufacturing Company Limited
0 cites - 0 cites
- US123394102025Determining Shear Slowness from Dipole Source-based Measurements Acquired by a Logging While Drilling Acoustic Measurement Tool
SCHLUMBERGER TECHNOLOGY CORPORATION
0 cites - US122781622025Coplanar Control for Film-type Thermal Interface
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites - US122666332025Semiconductor Structure and Method of Forming the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US122480542025System and Method for Detecting an Object in a Scene
Mitsubishi Electric Research Laboratories, Inc.
0 cites - US122242242025Package Structure with Metallic Layer Over the Surfaces of a Plurality of Semiconductor Dies
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US122101142025System and Method for Mutual Interference Mitigation of FMCW Automotive Radar
Mitsubishi Electric Research Laboratories, Inc.
0 cites - US122118182025Manufacturing Method of Semiconductor Package Using Jig
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US122131772025Suspendable CSMA/CA for IEEE 802.15.4 System to Reduce Packet Discard Caused by Backoff Failure
Mitsubishi Electric Research Laboratories, Inc.
0 cites - US121966792025High Throughput Snapshot Spectral Encoding Device for Fluorescence Spectral Microscopy
University Of Southern California
0 cites - US121541942024Coherent Optical Sensor with Sparse Illumination
Mitsubishi Electric Research Laboratories, Inc.
0 cites - US121320042024Semiconductor Devices and Methods of Manufacture
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites - US121051852024System and Method for Radar Object Recognition with Cross-frame Temporal Relationality
Mitsubishi Electric Research Laboratories, Inc.
0 cites - US121006402024High Efficiency Heat Dissipation Using Thermal Interface Material Film
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites - 0 cites
- US120636202024Bluetooth-based Spatial-temporal Localization
Mitsubishi Electric Research Laboratories, Inc.
0 cites - 0 cites
- US120339122024Package Structure and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US119963452024Package Structure and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US119904292024Dummy Die Placement Without Backside Chipping
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites - US119857052024System and Method for Active Carrier Sense Based CSMA/CA for IEEE 802.15.4 System to Avoid Packet Discard Caused by Interference
Mitsubishi Electric Corporation
0 cites - 0 cites
- US119730052024Coplanar Control for Film-type Thermal Interface
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites - US119490312024P-type Bifacial Solar Cell with Partial Rear Surface Field Passivation and Preparation Method Therefor
Tongwei Solar (Meishan) Co., Ltd.
0 cites - US119232592024Package Structure and Method of Manufacturing the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US119140232024System and Method for Tracking an Expanded State of a Moving Object Using a Compound Measurement Model
Mitsubishi Electric Research Laboratories, Inc.
0 cites - US119028112024Multi-band Wi-fi Fusion for WLAN Sensing
Mitsubishi Electric Research Laboratories, Inc.
0 cites - US118799642024System and Method for Tracking Expanded State of Moving Object with Model Geometry Learning
Mitsubishi Electric Research Laboratories, Inc.
0 cites - US118698222024Semiconductor Package and Manufacturing Method Thereof
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US118525202023Method for Determining Reflective Surface of Steering Gear and Focusing Steering Gear of External Level Gauge
XI'AN DINGHUA ELECTRONICS CO., Ltd.
0 cites - US118548772023Semiconductor Device and Manufacturing Method of the Same
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY Ltd.
0 cites - US118550032023Package Structure and Method of Fabricating the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US118550602023Package Structure and Method of Fabricating the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US118356732023Methods and Systems for Determining Fast and Slow Shear Directions in an Anisotropic Formation Using a Logging While Drilling Tool
SCHLUMBERGER TECHNOLOGY CORPORATION
0 cites - US118308212023Semiconductor Devices and Methods of Manufacture
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites - US118044682023Manufacturing Method of Semiconductor Package Using Jig
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US117423232023Semiconductor Structure and Method of Forming the Same
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites - US117053812023High Efficiency Heat Dissipation Using Thermal Interface Material Film
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites - 0 cites
- US116194942023System and Method for Tracking Expanded State of an Object
Mitsubishi Electric Research Laboratories, Inc.
0 cites - US115671832023Radar Detection of Moving Object with Waveform Separation Residual
Mitsubishi Electric Research Laboratories, Inc.
0 cites