Patents/Inventors

Priyal Shah

San Jose, CAUS6 patents

7 Patents

US123946832025
Molded Semiconductor Chip Package with Stair-step Molding Layer
ADVANCED MICRO DEVICES, Inc.
0 cites
US122781502025
Semiconductor Package with Annular Package Lid Structure
Advanced Micro Devices, Inc.
0 cites
US122495192025
Molded Chip Package with Anchor Structures
ADVANCED MICRO DEVICES, Inc.
0 cites
US119118392024
Low Temperature Hybrid Bonding
ADVANCED MICRO DEVICES, Inc.
0 cites
US118108912023
Bond Pads for Low Temperature Hybrid Bonding
ADVANCED MICRO DEVICES, Inc.
0 cites
US117423012023
Fan-out Package with Reinforcing Rivets
ADVANCED MICRO DEVICES, Inc.
0 cites
US116769242023
Semiconductor Chip with Reduced Pitch Conductive Pillars
ADVANCED MICRO DEVICES, Inc.
0 cites