Priscilla Diep Larosa

3 Patents

• US122858382025

  Wafer Edge Asymmetry Correction Using Groove in Polishing Pad

  Applied Materials, Inc.

  0 cites
• US119318542024

  Chemical Mechanical Polishing Using Time Share Control

  Applied Materials, Inc.

  0 cites
• US118839232024

  Chemical Mechanical Polishing Using Time Share Control

  Applied Materials, Inc.

  0 cites