Patents/Inventors

Prasad Ramanathan

Chandler, AZUS1 patent

2 Patents

US117054172023
Backside Metallization (BSM) on Stacked Die Packages and External Silicon at Wafer Level, Singulated Die Level, or Stacked Dies Level
Intel Corporation
0 cites
US115878432023
Thermal Bump Networks for Integrated Circuit Device Assemblies
Intel Corporation
0 cites