Praneeth Kumar Akkinepally

3 Patents

• US123946822025

  Organic Passivation for Fine Pitch Architectures

  Intel Corporation

  0 cites
• US117372082023

  Microelectronic Assemblies Having Conductive Structures with Different Thicknesses

  Intel Corporation

  0 cites
• US116886922023

  Embedded Multi-die Interconnect Bridge Having a Substrate with Conductive Pathways and a Molded Material Region with Through-mold Vias

  Intel Corporation

  0 cites