36 Patents
- US125910962026Technologies for a Beam Expansion and Collimation for Photonic Integrated Circuits
Intel Corporation
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- US125001372025Directly Impinging Pressure Modulated Spray Cooling and Methods of Target Temperature Control
Intel Corporation
0 cites - US124944352025Liquid Metal Interconnect for Modular System on an Interposer Server Architecture
Intel Corporation
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- US124112962025Reworkable Zero-force Insertion Electrical Optical Package Socket and Method
Intel Corporation
0 cites - US124130012025Heterogenous Socket Contact for Electrical and Mechanical Performance Scaling in a Microelectronic Package
Intel Corporation
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- US123459322025Die Last and Waveguide Last Architecture for Silicon Photonic Packaging
Intel Corporation
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- US123410802025Semiconductor Device Stack-up with Bulk Substrate Material to Mitigate Hot Spots
Intel Corporation
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- US122985722025Device, Method and System for Optical Communication with a Photonic Integrated Circuit Chip and a Transverse Oriented Lens Structure
Intel Corporation
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- US122306102025Double-sided Substrate with Cavities for Direct Die-to-die Interconnect
Intel Corporation
0 cites - US122132882025Self Cooling Adaptive Flow Branching Heat Exchanger System for Cooling of One or More Semiconductor Chips
Intel Corporation
0 cites - US121641472024Device, Method and System for Optical Communication with a Waveguide Structure and an Integrated Optical Coupler of a Photonic Integrated Circuit Chip
Intel Corporation
0 cites - US120876582024Hybrid Thermal Interface Material (TIM) with Reduced 3D Thermal Resistance
Intel Corporation
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- US120573702024Vacuum Modulated Two Phase Cooling Loop Efficiency and Parallelism Enhancement
Intel Corporation
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- US120210162024Thermally Enhanced Silicon Back End Layers for Improved Thermal Performance
Intel Corporation
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- US119786892024Semiconductor Device Stack-up with Bulk Substrate Material to Mitigate Hot Spots
Intel Corporation
0 cites - US118222492023Method and Apparatus to Develop Lithographically Defined High Aspect Ratio Interconnects
Intel Corporation
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- US118174232023Double-sided Substrate with Cavities for Direct Die-to-die Interconnect
Intel Corporation
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- US117568602023Semiconductor Device Stack-up with Bulk Substrate Material to Mitigate Hot Spots
Intel Corporation
0 cites - US116395562023Massively-parallel Micronozzle Array for Direct Write Electrodeposition of High-density Microstructure Arrays
Intel Corporation
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