Poh Boon Khoo

7 Patents

• US126047622026

  Methods and Apparatus to Reduce Thickness of On-package Memory Architectures

  Intel Corporation

  0 cites
• US125885112026

  Shielding Assembly for Semiconductor Packages

  Intel Corporation

  0 cites
• US125754482026

  Integrated Circuit Packages with on Package Memory Architectures

  Intel Corporation

  0 cites
• US124009522025

  Stripped Redistrubution-layer Fabrication for Package-top Embedded Multi-die Interconnect Bridge

  Intel Corporation

  0 cites
• US119087932024

  Stripped Redistrubution-layer Fabrication for Package-top Embedded Multi-die Interconnect Bridge

  Intel Corporation

  0 cites
• US116996442023

  Organic Mold Interconnects in Shielded Interconnects Frames for Integrated-circuit Packages

  Intel Corporation

  0 cites
• US116581112023

  Stripped Redistrubution-layer Fabrication for Package-top Embedded Multi-die Interconnect Bridge

  Intel Corporation

  0 cites