Po-yuan Cheng

5 Patents

• US124128022025

  Heat Dissipation Structures for Integrated Circuit Packages and Methods of Forming the Same

  Taiwan Semiconductor Manufacturing Co., Ltd.

  0 cites
• US123680842025

  Package Structure and Manufacturing Method Thereof

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites
• US122242242025

  Package Structure with Metallic Layer Over the Surfaces of a Plurality of Semiconductor Dies

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites
• US119963452024

  Package Structure and Manufacturing Method Thereof

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites
• US118698222024

  Semiconductor Package and Manufacturing Method Thereof

  Taiwan Semiconductor Manufacturing Company, Ltd.

  0 cites