Po-jen Cheng

5 Patents

• US123623162025

  Electronic Structure Having a Protrusion Structure Disposed in a Gap Between a Circuit Pattern Structure and a Packaging Structure

  ADVANCED SEMICONDUCTOR ENGINEERING, Inc.

  0 cites
• US121836832024

  Electronic Package Structure

  ADVANCED SEMICONDUCTOR ENGINEERING, Inc.

  0 cites
• US119618082024

  Electronic Package Structure with Reinforcement Element

  ADVANCED SEMICONDUCTOR ENGINEERING, Inc.

  0 cites
• US119232852024

  Electronic Device Package and Method of Manufacturing the Same

  ADVANCED SEMICONDUCTOR ENGINEERING, Inc.

  0 cites
• US116480342023

  Device, Instrument and Belt for Tying Cervix

  INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

  0 cites