Po-hao Chang

3 Patents

• US123344442025

  Semiconductor Package Structure and Method for Forming the Same

  MEDIATEK Inc.

  0 cites
• US122495992025

  Multiple Chip Module Trenched Lid and Low Coefficient of Thermal Expansion Stiffener Ring

  Apple Inc.

  0 cites
• US116463022023

  Multiple Chip Module Trenched Lid and Low Coefficient of Thermal Expansion Stiffener Ring

  Apple Inc.

  0 cites