Po Chih Yang

4 Patents

• US121258162024

  Semiconductor Device Assemblies and Systems with One or More Dies at Least Partially Embedded in a Redistribution Layer (RDL) and Methods for Making the Same

  Micron Technology, Inc.

  0 cites
• US120626352024

  Semiconductor Device Packages Including Conductors Electrically Connecting Stacked Semiconductor Devices by Extending Along Surfaces of the Semiconductor Devices

  Micron Technology, Inc.

  0 cites
• US120465132024

  Die Corner Protection by Using Polymer Deposition Technology

  Micron Technology, Inc.

  0 cites
• US117054212023

  Apparatus Including Solder-core Connectors and Methods of Manufacturing the Same

  Micron Technology, Inc.

  0 cites