Patents/Inventors

Ping-tzu Chen

TainanTW7 patents

9 Patents

US124698172025
Support Structure to Reinforce Stacked Semiconductor Wafers
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US123006692025
Backside Contact for Thermal Displacement in a Multi-wafer Stacked Integrated Circuit
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US122781512025
Semiconductor Wafer Seal Ring Having Protrusion Extending Into Trench in Semiconductor Substrate
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US122181062025
Backside Contact to Improve Thermal Dissipation Away from Semiconductor Devices
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US122058682025
Oversized via as Through-substrate-via (TSV) Stop Layer
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US121912822025
Shared Pad/bridge Layout for a 3D IC
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US117568622023
Oversized via as Through-substrate-via (TSV) Stop Layer
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US117569362023
Backside Contact to Improve Thermal Dissipation Away from Semiconductor Devices
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US116949972023
Backside Contact for Thermal Displacement in a Multi-wafer Stacked Integrated Circuit
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites