Patents/Inventors

Ping Ping Ooi

ButterworthMY2 patents

3 Patents

US121425702024
Composite Bridge Die-to-die Interconnects for Integrated-circuit Packages
Intel Corporation
0 cites
US120027932024
Integrating System in Package (sip) with Input/output (IO) Board for Platform Miniaturization
Intel Corporation
0 cites
US118374582023
Substrate with Gradiated Dielectric for Reducing Impedance Mismatch
Intel Corporation
0 cites