Patents/Inventors

Pi-yu Peng

Hsinchu CountyTW3 patents

3 Patents

US124566732025
Flip Chip Package and Substrate Thereof
CHIPBOND TECHNOLOGY CORPORATION
0 cites
US124328492025
Flip-chip Bonding Structure and Circuit Board Thereof
CHIPBOND TECHNOLOGY CORPORATION
0 cites
US117640902023
Tray
CHIPBOND TECHNOLOGY CORPORATION
0 cites