3 Patents
- US119877012024Thermosetting Resin Compositions, Liquid Packaging Material, Film, Semiconductor Package, Interlayer Insulating Film, and Flame-retardant Resin Composition
CHIN YEE CHEMICAL INDUSTRIES CO., Ltd.
0 cites - US119459132024Thermosetting Polyimide Resin and Manufacturing Method Thereof, Composition, Prepolymer, Film, Adhesive, and Use Thereof
CHIN YEE CHEMICAL INDUSTRIES CO., Ltd.
0 cites - US117321342023Benzocyclobutene-containing Polyimide Resin and Its Composition, Manufacturing Method, Redistribution Layer, Polyimide Film, and Use
CHIN YEE CHEMICAL INDUSTRIES CO., Ltd.
0 cites