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Inventors
Phongsak Sawasdee
Bangkok
TH
2 patents
3 Patents
US12293972
2025
Semiconductor Device and Method of Forming Leadframe with Clip Bond for Electrical Interconnect
UTAC Headquarters Pte. Ltd.
0 cites
US12230615
2025
Semiconductor Packages with Vertical Passive Components
UTAC Headquarters Pte. Ltd.
0 cites
US11784102
2023
Hermetic Semiconductor Packages
UTAC Headquarters Pte. Ltd.
0 cites