Patents/Inventors

Philip Yu-shuan Chung

TaipeiTW11 patents

10 Patents

US125819772026
Bonding Through Multi-shot Laser Reflow
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US124179272025
Semiconductor Device and Method of Manufacture
Taiwan Semiconductor Manufacturing Co., Ltd.
0 cites
US123681492025
Methods of Forming Semiconductor Packages
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US121763192024
Reflow Method and System
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US120403092024
Bonding Through Multi-shot Laser Reflow
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, Ltd.
0 cites
US119964002024
Manufacturing Method of Package on Package Structure
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US119424642024
Semiconductor Package and Method
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites
US118307462023
Semiconductor Device and Method of Manufacture
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites
US116462932023
Semiconductor Structure and Method
TAIWAN SEMICONDUCTOR MANUFACTURING CO., Ltd.
0 cites
US116108592023
Reflow Method and System
Taiwan Semiconductor Manufacturing Company, Ltd.
0 cites