Patents/Inventors

Phil Geng

Washougal, WAUS12 patents

13 Patents

US124944412025
BGA Stiffener Attachment with Low Eolife Adhesive Strength at High Solder Joint Stress Area Generated from Enabling Load
Intel Corporation
0 cites
US124761672025
Semiconductor Chip Package Thermo-mechanical Cooling Assembly
Intel Corporation
0 cites
US124530542025
Cooling Assembly with Strap Element to Diminish Lateral Movement of Cooling Mass During Installation of the Cooling Mass
Intel Corporation
0 cites
US123346742025
DIMM Retention Assembly for Compression Mount Technology and Land Grid Array Connector Loading
Intel Corporation
0 cites
US123157802025
Technologies for Processor Loading Mechanisms
Intel Corporation
0 cites
US123099332025
Magnetically Secured Semiconductor Chip Package Loading Assembly
Intel Corporation
0 cites
US123099662025
Thermally Conductive Chamber with Stiffening Structure for Thermal Cooling Assembly of Semiconductor Chip Package Under High Loading Force
Intel Corporation
0 cites
US122793952025
Patterned Bolster Plate and Composite Back Plate for Semiconductor Chip LGA Package and Cooling Assembly Retention
Intel Corporation
0 cites
US121319772024
Electronic Systems with Inverted Circuit Board with Heat Sink to Chassis Attachment
Intel Corporation
0 cites
US121333572024
Cold Plate Architecture for Liquid Cooling of Devices
Intel Corporation
0 cites
US119846852024
Retention Latch with Spring Mechanism
Intel Corporation
0 cites
US118429432023
Electronic Systems with Inverted Circuit Board with Heat Sink to Chassis Attachment
INTEL CORPORATION
0 cites
US115875972023
Connector Retention Mechanism for Improved Structural Reliability
Intel Corporation
0 cites