Pezhman Monadgemi

2 Patents

• US121912842025

  Thermally Efficient Semiconductor Device Assemblies Including Interposers Carrying a Subset of the External Contacts of the Assembly, and Methods of Making the Same

  Micron Technology, Inc.

  0 cites
• US117423282023

  Thermally Efficient Semiconductor Device Assemblies Including Interposers Carrying a Subset of the External Contacts of the Assembly, and Methods of Making the Same

  Micron Technology, Inc.

  0 cites