Patents/Inventors

Petteri Palm

RegensburgDE27 patents

24 Patents

US124314502025
Device Including Semiconductor Chips and Method for Producing Such Device
Infineon Technologies AG
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US124142362025
Electronic Device with Castellated Board
Infineon Technologies AG
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US123158352025
Pre-packaged Chip, Method of Manufacturing a Pre-packaged Chip, Semiconductor Package and Method of Manufacturing a Semiconductor Package
Infineon Technologies AG
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US122847532025
Electrostatic Discharge Protection of Electronic Component Embedded in Laminate of Printed Circuit Board
Infineon Technologies AG
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US122372462025
Semiconductor Devices Including Parallel Electrically Conductive Layers
Infineon Technologies AG
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US122180982025
Chip Assembling on Adhesion Layer or Dielectric Layer, Extending Beyond Chip, on Substrate
Infineon Technologies AG
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US121762832024
Die Package and Method of Forming a Die Package
Infineon Technologies AG
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US121598292024
Semiconductor Package with Non-uniformly Distributed Vias
Infineon Technologies Austria AG
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US120948072024
Stacked Transistor Chip Package with Source Coupling
Infineon Technologies AG
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US120806692024
Semiconductor Device Module Having Vertical Metallic Contacts and a Method for Fabricating the Same
Infineon Technologies Austria AG
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US120339092024
Die Package and Method of Manufacturing a Die Package
Infineon Technologies AG
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US120274812024
Device Including Semiconductor Chips and Method for Producing Such Device
Infineon Technologies AG
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US120149642024
Semiconductor Package Having an Electrically Insulating Core with Exposed Glass Fibres
Infineon Technologies Americas Corp.
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US120092902024
Semiconductor Module Having a Multi-branch Switch Node Connector
Infineon Technologies Austria AG
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US119967712024
Power Semiconductor System Having an Inductor Module Attached to a Power Stage Module
Infineon Technologies Austria AG
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US119786932024
Semiconductor Device Package Comprising Side Walls Connected with Contact Pads of a Semiconductor Die
Infineon Technologies AG
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US119790962024
Multiphase Inverter Apparatus Having Half-bridge Circuits and a Phase Output Lead for Each Half-bridge Circuit
Infineon Technologies Austria AG
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US119031322024
Power Electronic Assembly Having a Laminate Inlay and Method of Producing the Power Electronic Assembly
Infineon Technologies AG
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US117912552023
Die Package and Method of Forming a Die Package
Infineon Technologies AG
0 cites
US117929412023
Circuit Board Structure and Method for Manufacturing a Circuit Board Structure
IMBERATEK, LLC
0 cites
US117768822023
Method of Fabricating a Semiconductor Package
Infineon Technologies Austria AG
0 cites
US116643042023
Semiconductor Module
Infineon Technologies Austria AG
0 cites
US116328602023
Power Electronic Assembly and Method of Producing Thereof
Infineon Technologies AG
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US115691862023
Device Including Semiconductor Chips and Method for Producing Such Device
Infineon Technologies AG
0 cites