5 Patents
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- US122242222025Semiconductor Package Having a Thermally and Electrically Conductive Spacer
Infineon Technologies AG
0 cites - US121836672024Semiconductor Package with Power Electronics Carrier Having Trench Spacing Adapted for Delamination
Infineon Technologies AG
0 cites - 0 cites
- US116316282023Semiconductor Chip Package Comprising Substrate, Semiconductor Chip, and Leadframe and a Method for Fabricating the Same
Infineon Technologies AG
0 cites