23 Patents
- US125987492026Memory Device Including Composite Metal Oxide Semiconductor Channels and Methods for Forming the Same
Sandisk Technologies, Inc.
0 cites - US124577412025Memory Device Including Composite Metal Oxide Semiconductor Channels and Methods for Forming the Same
Sandisk Technologies, Inc.
0 cites - US123478042025Bonded Assembly Including Interconnect-level Bonding Pads and Methods of Forming the Same
Sandisk Technologies, Inc.
0 cites - 0 cites
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- US122898872025Three Dimensional Memory Device Containing Resonant Tunneling Barrier and High Mobility Channel and Method of Making the Same
Sandisk Technologies, Inc.
0 cites - US122454252025Three Dimensional Memory Device Containing Resonant Tunneling Barrier and High Mobility Channel and Method of Making Thereof
Sandisk Technologies, Inc.
0 cites - US122197562025Three Dimensional Memory Device Containing Resonant Tunneling Barrier and High Mobility Channel and Method of Making Thereof
SANDISK TECHNOLOGIES LLC
0 cites - US121258142024Bonded Assembly Containing Different Size Opposing Bonding Pads and Methods of Forming the Same
SANDISK TECHNOLOGIES LLC
0 cites - US121274102024Memory Device Including a Ferroelectric Semiconductor Channel and Methods of Forming the Same
SANDISK TECHNOLOGIES LLC
0 cites - US120161792024Three Dimensional Memory Device Containing Resonant Tunneling Barrier and High Mobility Channel and Method of Making Thereof
SANDISK TECHNOLOGIES LLC
0 cites - US119633522024Three-dimensional Memory Device with Vertical Field Effect Transistors and Method of Making Thereof
SANDISK TECHNOLOGIES LLC
0 cites - US119489022024Bonded Assembly Including an Airgap Containing Bonding-level Dielectric Layer and Methods of Forming the Same
SANDISK TECHNOLOGIES LLC
0 cites - US118698772024Bonded Assembly Including Inter-die via Structures and Methods for Making the Same
SANDISK TECHNOLOGIES LLC
0 cites - US117788172023Three-dimensional Memory Device Including III-V Compound Semiconductor Channel Layer and Method of Making the Same
SANDISK TECHNOLOGIES LLC
0 cites - US117283052023Capacitor Structure Including Bonding Pads as Electrodes and Methods of Forming the Same
SANDISK TECHNOLOGIES LLC
0 cites - US117217272023Three-dimensional Memory Device Including a Silicon-germanium Source Contact Layer and Method of Making the Same
SANDISK TECHNOLOGIES LLC
0 cites - US116769542023Bonded Three-dimensional Memory Devices with Backside Source Power Supply Mesh and Methods of Making the Same
SANDISK TECHNOLOGIES LLC
0 cites - 0 cites
- US116462822023Bonded Semiconductor Die Assembly with Metal Alloy Bonding Pads and Methods of Forming the Same
SANDISK TECHNOLOGIES LLC
0 cites - US116462832023Bonded Assembly Containing Low Dielectric Constant Bonding Dielectric Material
SANDISK TECHNOLOGIES LLC
0 cites - US115692152023Three-dimensional Memory Device with Vertical Field Effect Transistors and Method of Making Thereof
SANDISK TECHNOLOGIES LLC
0 cites - US115629752023Bonded Assembly Employing Metal-semiconductor Bonding and Metal-metal Bonding and Methods of Forming the Same
SANDISK TECHNOLOGIES LLC
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