Peter Delia

6 Patents

• US124827022025

  Wet Etch Process and Methods to Form Air Gaps Between Metal Interconnects

  Tokyo Electron Limited

  0 cites
• US122437492025

  Methods to Provide Uniform Wet Etching of Material Within High Aspect Ratio Features Provided on a Patterned Substrate

  Tokyo Electron Limited

  0 cites
• US121486242024

  Wet Etch Process and Method to Control Fin Height and Channel Area in a Fin Field Effect Transistor (finfet)

  Tokyo Electron Limited

  0 cites
• US121486252024

  Methods to Prevent Surface Charge Induced Cd-dependent Etching of Material Formed Within Features on a Patterned Substrate

  Tokyo Electron Limited

  0 cites
• US121005982024

  Methods for Planarizing a Substrate Using a Combined Wet Etch and Chemical Mechanical Polishing (CMP) Process

  Tokyo Electron Limited

  0 cites
• US121005992024

  Wet Etch Process and Method to Provide Uniform Etching of Material Formed Within Features Having Different Critical Dimension (CD)

  Tokyo Electron Limited

  0 cites