15 Patents
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- US125060982025Method for Chip Packaging with High-density Connection Layer, and Chip Packaging Structure
Jiangsu Silicon Integrity Semiconductor Technology Co., Ltd.
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- US123836862025Percutaneous Dilation Tracheostomy Device and Method of Using
University Of Maryland, College Park
0 cites - USD10832072025Lighter0 cites
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- USD10751342025Lighter0 cites
- US122916612025Quantum Dot Structure, Method for Producing a Quantum Dot Structure, and Light Emitting Device
OSRAM Opto Semiconductors GmbH
0 cites - USD10553682024Lighter0 cites
- US118967632024Percutaneous Dilation Tracheostomy Device and Method of Using
University Of Maryland, College Park
0 cites - US117953842023Nanoparticle, Structure, and Method for Producing a Nanoparticle
OSRAM Opto Semiconductors GmbH
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