Patents/Inventors

Peiqi Wang

Campbell, CAUS5 patents

6 Patents

US123157462025
Bottom Cover Plate to Reduce Wafer Planar Nonuniformity
Applied Materials, Inc.
0 cites
US120947732024
Methods for Low Resistivity and Stress Tungsten Gap Fill
APPLIED MATERIALS, Inc.
0 cites
US120376822024
Methods for Forming Low Resistivity Tungsten Features
Applied Materials, Inc.
0 cites
US119396682024
Gas Delivery for Tungsten-containing Layer
Applied Materials, Inc.
0 cites
US117988452023
Methods and Apparatus for Low Resistivity and Stress Tungsten Gap Fill
APPLIED MATERIALS, Inc.
0 cites
US116577332023
Training Method for Evaluating Bonding Accuracy of Orthodontic Brackets
Sichuan University
0 cites