Patents/Inventors

Pei-wei Wang

TaoyuanTW7 patents

7 Patents

US124395292025
Plurality of Build-up Layers in a Circuit Board Structure
UNIMICRON TECHNOLOGY Corp.
0 cites
US120573812024
Circuit Board Having Laminated Build-up Layers
Unimicron Technology Corp.
0 cites
US117929182023
Co-axial via Structure
Unimicron Technology Corp.
0 cites
US116417202023
Circuit Board and Manufacturing Method Thereof
Unimicron Technology Corp.
0 cites
US116009362023
Circuit Board Structure
Unimicron Technology Corp.
0 cites
US115629722023
Manufacturing Method of the Chip Package Structure Having at Least One Chip and at Least One Thermally Conductive Element
Unimicron Technology Corp.
0 cites
US115454122023
Package Structure and Manufacturing Method Thereof
Unimicron Technology Corp.
0 cites