Patents/Inventors

Paul R. Start

Chandler, AZUS2 patents

3 Patents

US121598132024
Embedded Bridge Die with Through-silicon Vias
Intel Corporation
0 cites
US118044702023
Wafer Level Passive Heat Spreader Interposer to Enable Improved Thermal Solution for Stacked Dies in Multi-chips Package and Warpage Control
Intel Corporation
0 cites
US115878512023
Embedded Bridge with Through-silicon Vias
Intel Corporation
0 cites