19 Patents
- 0 cites
- US125937032026Molded Bridge with Vertical Interconnects and Method of Making the Same
Deca Technologies USA, Inc.
0 cites - US125001982025Quad Flat No-lead (QFN) Package with Tie Bars and Direct Contact Interconnect Build-up Structure and Method for Making the Same
Deca Technologies USA, Inc.
0 cites - US125001972025Encapsulant-defined Land Grid Array (LGA) Package and Method for Making the Same
Deca Technologies USA, Inc.
0 cites - US124697762025Semiconductor Assembly Comprising a 3D Block and Method of Making the Same
Deca Technologies USA, Inc.
0 cites - US124245272025Multi-chip or Multi-chiplet Fan-out Device for Laminate and Leadframe Packages
Deca Technologies USA, Inc.
0 cites - US124244502025Embedded Component Interposer or Substrate Comprising Displacement Compensation Traces (dcts) and Method of Making the Same
Deca Technologies USA, Inc.
0 cites - US123623222025Method of Making a Fan-out Semiconductor Assembly with an Intermediate Carrier
Deca Technologies USA, Inc.
0 cites - US123005612025Fully Molded Structure with Multi-height Components Comprising Backside Conductive Material and Method for Making the Same
Deca Technologies USA, Inc.
0 cites - US122594272025Thermal Head Comprising a Plurality of Adapters for Independent Thermal Control of Zones
AEM Singapore Pte, Ltd.
0 cites - US122058812025Semiconductor Assembly Comprising a 3D Block and Method of Making the Same
Deca Technologies USA, Inc.
0 cites - US121702612024Molded Direct Contact Interconnect Structure Without Capture Pads and Method for the Same
Deca Technologies USA, Inc.
0 cites - US120625502024Molded Direct Contact Interconnect Substrate and Methods of Making Same
Deca Technologies USA, Inc.
0 cites - US119730512024Molded Direct Contact Interconnect Structure Without Capture Pads and Method for the Same
Deca Technologies USA, Inc.
0 cites - US118287952023Test System with a Thermal Head Comprising a Plurality of Adapters for Independent Thermal Control of Zones
AEM Holdings Ltd.
0 cites - 0 cites
- US117495342023Quad Flat No-lead (QFN) Package Without Leadframe and Direct Contact Interconnect Build-up Structure and Method for Making the Same
Deca Technologies USA, Inc.
0 cites - 0 cites
- US116562722023Test System with a Thermal Head Comprising a Plurality of Adapters and One or More Cold Plates for Independent Control of Zones
AEM Holdings Ltd.
0 cites