Patents/Inventors

Paul Qu

ShanghaiCN2 patents

4 Patents

US121144352024
Surface Mount Technology Method and Magnetic Carrier System
SANDISK TECHNOLOGIES, Inc.
0 cites
US120210602024
Reducing Keep-out-zone Area for a Semiconductor Device
Western Digital Technologies, Inc.
0 cites
US120210612024
Packaged Memory Device with Flip Chip and Wire Bond Dies
Western Digital Technologies, Inc.
0 cites
US118374762023
Flip-chip Package with Reduced Underfill Area
WESTERN DIGITAL TECHNOLOGIES, Inc.
0 cites