Paul Ganitzer

3 Patents

• US120877172024

  Semiconductor Package and Methods of Manufacturing a Semiconductor Package

  Infineon Technologies Austria AG

  0 cites
• US118482372023

  Composite Wafer, Semiconductor Device and Electronic Component

  Infineon Technologies AG

  0 cites
• US115520162023

  Semiconductor Device with Metallization Structure on Opposite Sides of a Semiconductor Portion

  Infineon Technologies AG

  0 cites