8 Patents
- US123549362025Semiconductor Device with a Nickel Comprising Layer and Method for Fabricating the Same
Infineon Technologies AG
0 cites - US122058702025Semiconductor Package and Method for Fabricating a Semiconductor Package
Infineon Technologies Austria AG
0 cites - US121598542024Semiconductor Device Having a Layer Stack, Semiconductor Arrangement and Method for Producing the Same
Infineon Technologies Austria AG
0 cites - US118879612024Semiconductor Device, Semiconductor Arrangement and Method for Producing the Same
Infineon Technologies Austria AG
0 cites - US116886702023Semiconductor Package and Method for Fabricating a Semiconductor Package
Infineon Technologies Austria AG
0 cites - US116159632023Electronic Device, Electronic Module and Methods for Fabricating the Same
Infineon Technologies AG
0 cites - US115811942023Sintering Method Using a Sacrificial Layer on the Backside Metallization of a Semiconductor Die
Infineon Technologies AG
0 cites - US115738982023System and Method for Facilitating Hybrid Hardware-managed and Software-managed Cache Coherency for Distributed Computing
Hewlett Packard Enterprise Development LP
0 cites