Patents/Inventors

Paul Armand Asentista Calo

MelakaMY3 patents

4 Patents

US122180382025
Leadframe, Semiconductor Package and Method
Infineon Technologies Austria AG
0 cites
US121320172024
Method of Soldering a Semiconductor Chip to a Chip Carrier
Infineon Technologies AG
0 cites
US120948072024
Stacked Transistor Chip Package with Source Coupling
Infineon Technologies AG
0 cites
US118308352023
Chip with Chip Pad and Associated Solder Flux Outgassing Trench
Infineon Technologies AG
0 cites