Patrick Variot

6 Patents

• US125435682026

  Thermoelectric Cooling for Die Packages

  Adeia Semiconductor Bonding Technologies Inc.

  0 cites
• US124762122025

  3d-interconnect

  Adeia Semiconductor Technologies LLC

  0 cites
• US123947282025

  Method of Forming a Region Shielding Within a Package of a Microelectronic Device

  Adeia Semiconductor Technologies LLC

  0 cites
• US120402842024

  3d-interconnect with Electromagnetic Interference (“EMI”) Shield And/or Antenna

  Invensas LLC

  0 cites
• US120210412024

  Region Shielding Within a Package of a Microelectronic Device

  Invensas LLC

  0 cites
• US119293372024

  3d-interconnect

  Invensas LLC

  0 cites