Panjae Park

5 Patents

• US125507182026

  Semiconductor Devices Having Improved Electrical Interconnect Structures

  Samsung Electronics Co., Ltd.

  0 cites
• US124944302025

  Integrated Circuit Devices Including Lower Interconnect Metal Layers at Cell Boundaries and Methods of Forming the Same

  SAMSUNG ELECTRONICS CO., Ltd.

  0 cites
• US124752932025

  Cell Including Individual Source Regions and Integrated Circuit Including the Cell

  SAMSUNG ELECTRONICS CO., Ltd.

  0 cites
• US120516962024

  Method of Fabricating a Semiconductor Device

  Samsung Electronics Co., Ltd.

  0 cites
• US118044802023

  Integrated Circuit Chip Including Standard Cell

  Samsung Electronics Co., Ltd.

  0 cites