Patents/Inventors

Padam Jain

San Jose, CAUS11 patents

10 Patents

US125885102026
Weight Optimized Stiffener and Sealing Structure for Direct Liquid Cooled Modules
Google LLC
0 cites
US125688212026
Pin Fin Placement Assembly for Forming Temperature Control Element Utilized in Device Die Packages
Google LLC
0 cites
US124245092025
Compliant Pad Spacer for Three-dimensional Integrated Circuit Package
Google LLC
0 cites
US123157822025
Spring Loaded Compliant Coolant Distribution Manifold for Direct Liquid Cooled Modules
Google LLC
0 cites
US122726192025
Direct Liquid Cooling with O-ring Sealing
Google LLC
0 cites
US122438022025
Methods and Heat Distribution Devices for Thermal Management of Chip Assemblies
Google LLC
0 cites
US119903862024
Methods and Heat Distribution Devices for Thermal Management of Chip Assemblies
Google LLC
0 cites
US119554062024
Temperature Control Element Utilized in Device Die Packages
Google LLC
0 cites
US117216412023
Weight Optimized Stiffener and Sealing Structure for Direct Liquid Cooled Modules
Google LLC
0 cites
US116643292023
Weight Optimized Stiffener and Sealing Structure for Direct Liquid Cooled Modules
Google LLC
0 cites