Patents/Inventors

Owen R. Fay

Meridian, IDUS33 patents

35 Patents

US125436102026
Microelectronic Device Assemblies, Stacked Semiconductor Die Assemblies, and Memory Device Packages
0 cites
US125061182025
Perpendicular Semiconductor Device Assemblies and Associated Methods
Micron Technology, Inc.
0 cites
US124944442025
Semiconductor Device with Tunable Antenna Using Wire Bonds
Micron Technology, Inc.
0 cites
US124008772025
Semiconductor Devices with Flexible Reinforcement Structure
Micron Technology, Inc.
0 cites
US123947502025
Semiconductor Assemblies with Redistribution Structures for Die Stack Signal Routing
Micron Technology, Inc.
0 cites
US122728702025
Tunable Integrated Millimeter Wave Antenna Using Laser Ablation And/or Fuses
Micron Technology, Inc.
0 cites
US122181012025
Three-dimensional Stacking Semiconductor Assemblies and Methods of Manufacturing the Same
Micron Technology, Inc.
0 cites
US122181192025
Stacked Interposer Structures
Micron Technology, Inc.
0 cites
US121990012025
Semiconductor Assemblies Including Vertically Integrated Circuits and Methods of Manufacturing the Same
Micron Technology, Inc.
0 cites
US121990682025
Methods of Forming Microelectronic Device Assemblies and Packages
Micron Technology, Inc.
0 cites
US121911622025
Semiconductor Device Assembly with Pillar Array
Micron Technology, Inc.
0 cites
US121702752024
Graphics Processing Unit and High Bandwidth Memory Integration Using Integrated Interface and Silicon Interposer
Micron Technology, Inc.
0 cites
US121487112024
Semiconductor Packages and Associated Methods with Antennas and EMI Isolation Shields
0 cites
US120626072024
Low Cost Three-dimensional Stacking Semiconductor Assemblies
Micron Technology, Inc.
0 cites
US120516702024
Use of Pre-channeled Materials for Anisotropic Conductors
Micron Technology, Inc.
0 cites
US120339292024
Package-on-package Semiconductor Assemblies and Methods of Manufacturing the Same
0 cites
US120274982024
Three-dimensional Stacking Semiconductor Assemblies with Near Zero Bond Line Thickness
Micron Technology, Inc.
0 cites
US119903502024
Semiconductor Devices with Flexible Reinforcement Structure
Micron Technology, Inc.
0 cites
US119904462024
Semiconductor Assemblies with Redistribution Structures for Die Stack Signal Routing
Micron Technology, Inc.
0 cites
US119730622024
High Density Pillar Interconnect Conversion with Stack to Substrate Connection
Micron Technology, Inc.
0 cites
US119618252024
Microelectronic Device Assemblies and Packages Including Multiple Device Stacks and Related Methods
Micron Technology, Inc.
0 cites
US119489212024
Methods of Forming Stacked Semiconductors Die Assemblies
0 cites
US119088142024
Fabricated Two-sided Millimeter Wave Antenna Using Through-silicon-vias
Micron Technology, Inc.
0 cites
US118482992023
Edge-notched Substrate Packaging and Associated Systems and Methods
Micron Technology, Inc.
0 cites
US117912522023
Package-on-package Semiconductor Assemblies and Methods of Manufacturing the Same
0 cites
US117913152023
Semiconductor Assemblies Including Thermal Circuits and Methods of Manufacturing the Same
Micron Technology, Inc.
0 cites
US117355492023
Methods and Systems for Manufacturing Pillar Structures on Semiconductor Devices
Micron Technology, Inc.
0 cites
US117108882023
Millimeter Wave Antenna and EMI Shielding Integrated with Fan-out Package
Micron Technology, Inc.
0 cites
US116642912023
Semiconductor Assemblies Including Vertically Integrated Circuits and Methods of Manufacturing the Same
Micron Technology, Inc.
0 cites
US116522832023
Integrated Antenna Using Through Silicon Vias
Micron Technology, Inc.
0 cites
US116316442023
High Density Pillar Interconnect Conversion with Stack to Substrate Connection
Micron Technology, Inc.
0 cites
US115879122023
High Density Pillar Interconnect Conversion with Stack to Substrate Connection
Micron Technology, Inc.
0 cites
US115882332023
Tunable Integrated Millimeter Wave Antenna Using Laser Ablation And/or Fuses
Micron Technology, Inc.
0 cites
US115748202023
Semiconductor Devices with Flexible Reinforcement Structure
Micron Technology, Inc.
0 cites
US115520452023
Semiconductor Assemblies with Redistribution Structures for Die Stack Signal Routing
Micron Technology, Inc.
0 cites