Patents/Inventors

Osvaldo Jorge Lopez

Annandale, NJUS10 patents

10 Patents

US125750252026
Stress Relief Structure for Flip-chip Packaged Devices
TEXAS INSTRUMENTS INCORPORATED
0 cites
US124069152025
Plated Metal Layer in Power Packages
Texas Instruments Incorporated
0 cites
US122438092025
Packaged Electronic Device with Film Isolated Power Stack
TEXAS INSTRUMENTS INCORPORATED
0 cites
US121762742024
Multi-die Package with Multiple Heat Channels
TEXAS INSTRUMENTS INCORPORATED
0 cites
US119305902024
Stress Relief for Flip-chip Packaged Devices
TEXAS INSTRUMENTS INCORPORATED
0 cites
US119087802024
Semiconductor Package with Solder Standoff
TEXAS INSTRUMENTS INCORPORATED
0 cites
US118173752023
High I/O Density Flip-chip QFN
TEXAS INSTRUMENTS INCORPORATED
0 cites
US117841142023
Plated Metal Layer in Power Packages
TEXAS INSTRUMENTS INCORPORATED
0 cites
US116581302023
Conductive Plate Stress Reduction Feature
TEXAS INSTRUMENTS INCORPORATED
0 cites
US116409322023
Packaged Electronic Device with Film Isolated Power Stack
TEXAS INSTRUMENTS INCORPORATED
0 cites