Patents/Inventors

Oseob Jeon

SeoulKR23 patents

19 Patents

US126222752026
Semiconductor Package Having Cooling Systems with Flow Control Devices Within Substrates
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US126108292026
Power Module Package with Molded via and Dual Side Press-fit Pin
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US126108182026
Single Switch Direct Cooling Assemblies and Related Methods
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
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US125502632026
Switching Oscillation Reduction for Power Semiconductor Device Modules
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
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US125507542026
Current Sharing Mismatch Reduction in Power Semiconductor Device Modules
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
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US124763972025
Transfer Molded Power Modules and Methods of Manufacture
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US124712042025
Semiconductor Device Modules
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US124009332025
Jet Impingement Heatsink for High Power Semiconductor Devices
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US123680852025
Integration of Semiconductor Device Assemblies with Thermal Dissipation Mechanisms
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
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US123158262025
Semiconductor Device Package Assemblies with Direct Leadframe Attachment
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US122726152025
Thermal Mismatch Reduction in Semiconductor Device Modules
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
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US122665902025
Dual Side Direct Cooling Semiconductor Package
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
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US122306012025
High Power Module Package Structures
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US122306062025
Semiconductor Package and Related Methods
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US122305512025
Immersion Direct Cooling Modules
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US119675402024
Integrated Circuit Direct Cooling Systems Having Substrates in Contact with a Cooling Medium
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
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US119617822024
Integration of Semiconductor Device Assemblies with Thermal Dissipation Mechanisms
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US119013092024
Semiconductor Device Package Assemblies with Direct Leadframe Attachment
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites
US116159672023
Power Module Package and Method of Manufacturing the Same
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
0 cites