8 Patents
- US120684432024Forming Conformable Layer with Flap on Semiconductor Devices
META PLATFORMS TECHNOLOGIES, LLC
0 cites - US117568102023Detection of Force Applied by Pick-up Tool for Transferring Semiconductor Devices
Meta Platforms Technologies, LLC
0 cites - US117356892023Dielectric-dielectric and Metallization Bonding via Plasma Activation and Laser-induced Heating
Meta Platforms Technologies, LLC
0 cites - 0 cites
- US116705312023Bridge Pick-up Head for Transferring Semiconductor Devices
Meta Platforms Technologies, LLC
0 cites - US115750692023Employing Deformable Contacts and Pre-applied Underfill for Bonding LED Devices via Lasers
Meta Platforms Technologies, LLC
0 cites - US115631422023Curing Pre-applied and Plasma-etched Underfill via a Laser
Meta Platforms Technologies, LLC
0 cites - US115576922023Selectively Bonding Light-emitting Devices via a Pulsed Laser
Meta Platforms Technologies, LLC
0 cites