6 Patents
- US125435782026Electronic Packaging Architecture with Customized Variable Metal Thickness on Same Buildup Layer
Intel Corporation
0 cites - US121911612025Multi-step Isotropic Etch Patterning of Thick Copper Layers for Forming High Aspect-ratio Conductors
Intel Corporation
0 cites - US119488482024Subtractive Etch Resolution Implementing a Functional Thin Metal Resist
Intel Corporation
0 cites - 0 cites
- US117216312023Via Structures Having Tapered Profiles for Embedded Interconnect Bridge Substrates
Intel Corporation
0 cites - 0 cites