Patents/Inventors

Osamu Nabeya

TokyoJP15 patents

16 Patents

US123810892025
Information Processing System, Information Processing Method, Program, and Substrate Processing Apparatus
EBARA CORPORATION
0 cites
US123580962025
Rubber Membrane Having First and Second Hardness for Use in a Polishing Head
EBARA CORPORATION
0 cites
US123374382025
Break-in Processing Apparatus and Break-in Processing Method
EBARA CORPORATION
0 cites
US122305292025
Substrate Holding Apparatus, Substrate Suction Determination Method, Substrate Polishing Apparatus, Substrate Polishing Method, Method of Removing Liquid from Upper Surface of Wafer to Be Polished, Elastic Film for Pressing Wafer Against Polishing Pad, Substrate Release Method, and Constant Amount Gas Supply Apparatus
EBARA CORPORATION
0 cites
US121836422024
Film-thickness Measuring Method, Method of Detecting Notch Portion, and Polishing Apparatus
EBARA CORPORATION
0 cites
US121285232024
Polishing Apparatus
EBARA CORPORATION
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US120681892024
Elastic Membrane, Substrate Holding Device, and Polishing Apparatus
EBARA CORPORATION
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US119581632024
Substrate Holding Apparatus, Elastic Membrane, Polishing Apparatus, and Method for Replacing Elastic Membrane
EBARA CORPORATION
0 cites
USD10218322024
Elastic Membrane
EBARA CORPORATION
0 cites
US117525902023
Polishing Head and Polishing Apparatus
EBARA CORPORATION
0 cites
US117453062023
Polishing Apparatus and Method of Controlling Inclination of Stationary Ring
EBARA CORPORATION
0 cites
US117312352023
Polishing Apparatus and Polishing Method
EBARA CORPORATION
0 cites
USD09890122023
Elastic Membrane
EBARA CORPORATION
0 cites
US116545242023
Method of Detecting Abnormality of a Roller Which Transmits a Local Load to a Retainer Ring, and Polishing Apparatus
EBARA CORPORATION
0 cites
USD09819692023
Elastic Membrane for Semiconductor Wafer Polishing Apparatus
EBARA CORPORATION
0 cites
USD09814592023
Retaining Ring for Substrate
EBARA CORPORATION
0 cites