Patents/Inventors

Osamu Munekata

TokyoJP1 patent

2 Patents

US117127602023
Layered Bonding Material, Semiconductor Package, and Power Module
SENJU METAL INDUSTRY CO., Ltd.
0 cites
US115839592023
Solder Alloy, Solder Power, and Solder Joint
SENJU METAL INDUSTRY CO., Ltd.
0 cites