Patents/Inventors

Osamu Matsuzawa

SagaJP1 patent

2 Patents

US122372932025
Palladium-coated Copper Bonding Wire, Manufacturing Method of Palladium-coated Copper Bonding Wire, Wire Bonding Structure Using the Same, Semiconductor Device and Manufacturing Method Thereof
TANAKA DENSHI KOGYO K. K.
0 cites
US119963822024
Palladium-coated Copper Bonding Wire, Manufacturing Method of Palladium-coated Copper Bonding Wire, Semiconductor Device Using the Same, and Manufacturing Method Thereof
TANAKA DENSHI KOGYO K. K.
0 cites