Patents/Inventors

Osamu Kakutani

TokyoJP2 patents

3 Patents

US123746502025
Manufacturing Apparatus and Manufacturing Method of Semiconductor Device
SHINKAWA Ltd.
0 cites
US120806792024
Bonding Apparatus and Alignment Method
SHINKAWA Ltd.
0 cites
US120574272024
Wire Bonding Apparatus
SHINKAWA Ltd.
0 cites