Patents/Inventors

Omkar Karhade

Chandler, AZUS36 patents

34 Patents

US125990072026
Composite IC Die Package Including an Electro-thermo-mechanical Die (ETMD) with Through Substrate Vias
Intel Corporation
0 cites
US125990502026
Multi-level Die Coupled with a Substrate
Intel Corporation
0 cites
US125640902026
Edge-aligned Template Structure for Integrated Packages Including an Integrated Circuit Device Within an Opening of the Template Structure
Intel Corporation
0 cites
US125410552026
Electronic Device Including a Lens Assembly
Intel Corporation
0 cites
US125060852025
HBI Die Architecture with Fiducial in Street for No Metal Depopulation in Active Die
Intel Corporation
0 cites
US125001322025
Formation of a Reconstituted Circuit Device Using Flow of a Material by Capillary Action
Intel Corporation
0 cites
US124811082025
Faraday Rotator Interconnect as a Through-via Configuration in a Patch Architecture
Intel Corporation
0 cites
US124761742025
Ultra-thin, Hyper-density Semiconductor Packages
Intel Corporation
0 cites
US124698012025
Moisture Seal Coating of Hybrid Bonded Stacked Die Package Assembly
Intel Corporation
0 cites
US124429822025
Temperature Sensor to Achieve Thermal Stabilization of Micro-ring Resonator (MRR) in an Open Cavity Photonic Integrated Circuit (OCPIC)
Intel Corporation
0 cites
US124430582025
On-cavity Photonic Integrated Circuit (OCPIC) to Achieve the Most Undercut Real Estate for Effective Thermal Tuning
Intel Corporation
0 cites
US124364132025
Undercut Design with a Bonded Base Cover for Friendly Assembly and Effective Thermal Tuning of Micro-ring Resonator (MRR) in Open Cavity Photonic Integrated Chips (OCPIC)
Intel Corporation
0 cites
US124068932025
Edge-aligned Template Structure for Integrated Circuit Packages
Intel Corporation
0 cites
US124069142025
Ultra-thin, Hyper-density Semiconductor Packages
Intel Corporation
0 cites
US123861272025
Micro-lens Array Optically Coupled with a Photonics Die
Intel Corporation
0 cites
US123667132025
Heat Dissipation Structures for Optical Communication Devices
Intel Corporation
0 cites
US123344722025
Multiple Wafer Stack Architecture to Enable Singulation
Intel Corporation
0 cites
US123278142025
Electronic Substrate Core Having an Embedded Laser Stop to Control Depth of an Ultra-deep Cavity
Intel Corporation
0 cites
US121762682024
Open Cavity Bridge Co-planar Placement Architectures and Processes
Intel Corporation
0 cites
US121487442024
Optical Multichip Package with Multiple System-on-chip Dies
Intel Corporation
0 cites
US120682222024
Dummy Die Structures of a Packaged Integrated Circuit Device
Intel Corporation
0 cites
US120613712024
Patch on Interposer Architecture for Low Cost Optical Co-packaging
Intel Corporation
0 cites
US120448882024
Silicon Groove Architectures and Manufacturing Processes for Passive Alignment in a Photonics Die
Intel Corporation
0 cites
US120274482024
Open Cavity Bridge Power Delivery Architectures and Processes
Intel Corporation
0 cites
US120030232024
In-package 3D Antenna
Intel Corporation
0 cites
US118044562023
Wirebond and Leadframe Magnetic Inductors
Intel Corporation
0 cites
US117354952023
Active Package Cooling Structures Using Molded Substrate Packaging Technology
Intel Corporation
0 cites
US116769002023
Electronic Assembly That Includes a Bridge
Intel Corporation
0 cites
US116162832023
5G Mmwave Antenna Architecture with Thermal Management
Intel Corporation
0 cites
US116111642023
Wideband Multi-pin Edge Connector for Radio Frequency Front End Module
Intel Corporation
0 cites
US115812402023
Liquid Thermal Interface Material in Electronic Packaging
Intel Corporation
0 cites
US115748512023
Coupled Cooling Fins in Ultra-small Systems
Intel Corporation
0 cites
US115520352023
Electronic Package with Stud Bump Electrical Connections
Intel Corporation
0 cites
US115454072023
Thermal Management Solutions for Integrated Circuit Packages
Intel Corporation
0 cites